Power Bank PCBA Manufactuer

We offer end-to-end services from design development to PCB prototyping, including component procurement, soldering and debugging, and enclosure assembly. Every PCBA undergoes comprehensive testing and comes with a 1-year warranty.

Our PCBA Product

Power Bank Circuit Board,Power Bank Mainboard 3.7V ,Ternary Lithium Battery 18650 Polymer PCB Boost Board,This product is a power bank mainboard. Familiarity with soldering iron techniques is required. Exercise caution during soldering—do not reverse connections and ensure solder does not contact other components.

X7 Power Bank PCB Board

V16 Powerbank PCB Board

V16 Powerbank PCB Board

U8 Powerbank pcb Board

U8 Powerbank pcb Board

Q16BT bOARD

Q16BT Power Bank PCB Board

Q8 Powenbank PCB Board

Q8 Powenbank PCB Board

M3 Power Bnak PCB Board

M3 Power Bnak PCB Board

K7 Board 12V Air Conditioning Fan

K7 Board 12V Air Conditioning Fan

A8188 Board

A8188 Power Bank PCB Board

A8 Board

A8 Power Bank PCB Board

U5 Power Bank PCB Board

U5 Power Bank PCB Board

Our Service

From blank board design to finished production, we provide you with a one-stop solution.

An electronics engineer designs color-coded PCB layout diagrams

PCBA Solution

Short development cycles and rapid prototyping. In a cycle time counted in hours, our team of 30 dedicated R&D professionals analyze circuit functionnalities and performance requirements and other specifications and develop tailor made PCBA Solution.

Detailed close-up of a green-substrate PCB board

PCB Manufacturing

Professional multi-layer PCB prototyping and volume production. We use 50 CNC drilling machines, plated-through holes, 30 exposure machines, 20 testers, and fully automated AOI inspection from our seasoned technical team. ISO9001 Quality control.

Neatly stacked on the shelving unit are mass-produced green-substrate finished PCB boards

PCBA Prototype

We use precision engineering techniques that allow boards to be cloned very quickly and with a very high success rate of modification so as to drastically shorten design cycles and increase development efficiency. From design and reverse engineering to prototyping and production. SMT Assembly

FUJI SMT pick-and-place machine line on the manufacturing production floor

SMT Assembly

Team of over 200 people to serve you with 30 high-speed pick-and-place machines, 15 reflow ovens, and other test equipment and lines we have installed and working. Quality control and inspection risks to make sure the product meets customer requirements and expectations. We deliver small and big batches.

Our Production Process

We have over 10 years of experience in designing and manufacturing charging PCBA solutions. Simply share your ideas with us, and we'll help you bring them to life from concept to reality—saving you both time and costs.

Solder Paste Printer

Solder Paste Printer

SMT Assembly Line

SMT Assembly Line

Reflow Oven

Reflow Oven

AOI Inspection System

AOI Inspection System

Product Packaging

Product Packaging

Through-Hole Assembly

Through-Hole Assembly

Post-Soldering

Post-Soldering

Assembly Production Line

Assembly Production Line

Our PCBA Techniques

From blank board design to finished production, we provide you with a one-stop solution.

Hot Air Leveling (HAL)

Hot Air Leveling (HAL)

Physically apply a protection layer using hot air leveling. Control Thickness: 2–40 μm. Advantages: Solderability and compatibility with assembly processes, longer shelf life. Disadvantages: Contains lead, poor surface flatness.

Electroless Gold

Electroless Gold

In an electroless gold process, a chemical reaction between copper and another metal produces a thin, adherent deposit of a nickel-gold layer upon the copper surface. Control Thickness: thickness of metal deposit is from 0.05 to 0.1μm. Advantages: uniformity of plating thickness, good solderability, long shelf life. Disadvantages: Quick and process expensive, and negative assess (black disc) problems.

Organic Solderability Preservative

Process organic protective film coating on the copper surface. Control Thickness: film coating is normally 0.2~0.6μm, most guaranteed at 0.5μm. Advantages: uniformity of film thickness, low cost of process. Disadvantages: Not easy to bear several reflow soldering cycles.

Gold Fingers

Gold Fingers

A thin layer of nickel and gold is deposited on the copper via an electrolytic oxidation-reduction chemical reaction. Control Thickness: 0.25~1.5μm typical. Advantages: Wear resistant, oxidation resistant, low resistance. Disadvantages: Anti-soldering property somewhat poor, high process cost, used mainly based on performance requirements.

Contact us

If you have any questions or queries,we will be always happy to help. Feel free to contact us by telephone or email.

Address

6/F, Building 24, Longbi Industrial City, No. 27 Dafa Road, Bantian, Longgang District, Shenzhen, China

Contact

Get solution in 24 hours

Mold and Molding

Get A Quote

If you have any questions or queries,we will be always happy to help. Feel free to contact us by telephone or email.

Please leave your message here. We only collect the content of your message and will not ask for any personal privacy information.
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Get A Quote

If you have any questions or queries,we will be always happy to help. Feel free to contact us by telephone or email:sales@yousanpower.com

Please leave your message here. We only collect the content of your message and will not ask for any personal privacy information.